PCB Specification：
Type：VGA
12 Layer
Thickness: 1.58+/-0.15mm
Min. Drill：0.2mm
Mini trace width/space:0.075/0.089mm
Impedance:±10%
FR4 Tg:150℃，0.5oz/1oz Cu
BGA PAD Size：0.3mm
Surface finishing：OSP+G/F