PCB Specification：
Type：Instrument Panel
8 Layer
Thickness: 1.6+/-0.16mm
Min. Drill：0.25mm
Mini trace width/space:0.1/0.2mm
Impedance:±10%
FR4 Tg:150℃,IT158  1oz/1oz Cu
BGA PAD Size：0.35/0.4mm
Surface finishing：ENIG