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Copper Coin Inlay Design

PCB Specification:
Type:Copper Coin Inlay Design
4 Layer
Thickness: 1.6+/-0.15mm
FR4 Tg:150℃,1oz Cu
Surface finishing:ENIG
Application: Thermal Management Solutions
Solid copper press fitted into the board
Can be applied in cavity or top to bottom
PTH may be connected if required
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